Description
The Mechanic XG-Z40 35G 183°C Solder Paste is a high-quality professional soldering solution designed to meet the demanding needs of modern electronics repair and assembly. Specially formulated for BGA chip soldering, SMD component mounting, and precision electronic work, this solder paste delivers reliable performance, strong solder joints, and excellent wetting characteristics. Whether you are working in mobile phone repair, electronics manufacturing, or advanced PCB rework, this solder paste is built to provide accuracy, efficiency, and consistency.
Packaged in a convenient syringe format (10ml / 35g), the Mechanic XG-Z40 solder paste can be used straight out of the package with no prior preparation. This user-friendly design makes it ideal for both professional technicians and advanced hobbyists who need precise application and minimal waste. The syringe allows controlled dispensing, ensuring clean and accurate placement even on fine-pitch components and densely populated circuit boards.
At its core, this solder paste is composed of Sn-63% and Pb-37%, a classic and trusted alloy ratio widely used in electronics due to its excellent flow characteristics and predictable melting behavior. With a melting point of approximately 183–200°C, it enables smooth soldering at relatively low temperatures, reducing thermal stress on sensitive components such as ICs, BGAs, and microchips. This makes it especially suitable for mobile repair tools and phone repair products, where heat management is critical.
One of the standout features of the Mechanic XG-Z40 solder paste is its No Clean flux formulation. During soldering, the flux activates efficiently, promoting strong adhesion between solder pads and component leads while minimizing oxidation. After soldering, residues are minimal and do not require cleaning, helping save time and effort during post-solder inspection. When cleaning is needed, any remaining residue can be easily washed off with alcohol-based products, keeping the PCB surface neat and professional.
The solder particle size of 24–45 µm ensures excellent consistency and smooth application. Fine particle size plays a crucial role in stencil printing and precise dispensing, allowing the paste to spread evenly and fill solder pads accurately. This consistency is essential for mechanized, semi-automated, and automated soldering processes, where uniform solder deposits directly impact joint quality and reliability.
Solder pastes like the Mechanic XG-Z40 are widely used in the electronics industry for mounting planar (SMD) components on printed circuit boards. Thanks to its stable viscosity and excellent printability, this paste performs exceptionally well in stencil-based applications, making it suitable for small-scale production lines and repair workshops alike. The ability to apply the paste in an even, controlled layer leads to significant solder savings and reduces the risk of bridging or insufficient solder joints.
Beyond electronics repair, special solder pastes also find application in other technical fields, such as the installation of copper and brass pipes and fittings in water supply systems. While primarily optimized for electronics, the reliable bonding characteristics of this paste highlight its versatility and strong metallurgical performance.
The main advantage of using Mechanic XG-Z40 solder paste lies in the ease of mechanization. The paste can be applied using manual syringes, precision dispensers, or stencil printing methods. This flexibility allows technicians to scale their workflow efficiently, whether performing delicate phone motherboard repairs or handling batch PCB assembly. Automated application ensures repeatable results, cleaner joints, and reduced rework rates.
For technicians working with electronics tools, mobile repair products, and phone repair tools, reliability is non-negotiable. The Mechanic XG-Z40 183°C solder paste is engineered to deliver consistent results across a wide range of soldering tasks, from BGA reballing and IC placement to fine SMD component repairs. Its smooth melting behavior and strong bonding help create durable solder joints that withstand thermal cycling and everyday device usage.
In summary, the Mechanic XG-Z40 35G 183 Degree Solder Paste is a trusted choice for professionals who demand precision, efficiency, and clean results. With its No Clean flux, fine particle size, convenient syringe packaging, and proven Sn63/Pb37 composition, it stands out as an essential soldering paste for modern electronics repair and assembly. Whether you are upgrading your electronics tools or expanding your phone repair products lineup, this solder paste offers dependable performance you can count on.
Product Specifications:
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Product Type: Solder Paste
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Model: Mechanic XG-Z40
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Net Weight: 35g (10ml)
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Composition: Sn-63%, Pb-37%
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Solder Particle Size: 24–45 µm
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Flux Type: No Clean
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Melting Point: 183–200°C
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Application: BGA, SMD, PCB soldering
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Residue: Minimal, no cleaning required
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Cleaning Method: Alcohol-based products
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Packaging: Syringe for precise application
